Patent Assignment
Reel/Frame 024127/0882
Assignment of Assignor's Interest
Recorded: 2010-03-24
Pages: 5
Assignors
LEE, KEUNHYUK
Executed: 2010-03-05
JEON, OSEOB
Executed: 2010-03-05
LIM, SEUNGWON
Executed: 2010-03-05
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
82-3, DODANG-DONG, WOMNI-GU DISTRICT, GYEONGGI-DO, BUCHEON-SI, 420-711, KOREA, REPUBLIC OF
Covered Property
(1)
Power Module Package Having Excellent Heat Sink Emission Capability and Method for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →