Patent Assignment
Reel/Frame 024155/0071
Assignment of Assignor's Interest
Recorded: 2010-03-29
Pages: 4
Assignors
CHANG, HSIAO-CHUAN
Executed: 2010-03-25
TSAI, TSUNG-YUEH
Executed: 2010-03-25
LAI, YI-SHAO
Executed: 2010-03-25
CHENG, MING-HSIANG
Executed: 2010-03-25
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, JINGSAN RD., NANTZ CHIU, KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Semiconductor Device Package Having a Buffer Structure and Method of Fabricating the Same