IP Library › Assignment 024156/0739
Patent Assignment
Reel/Frame 024156/0739

Assignment of Assignor's Interest

Recorded: 2010-03-25 Pages: 4
Assignor
Assignee
SAMSUNG LED CO., LTD.
314, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYUNGGI-DO, 442-743, KOREA, REPUBLIC OF
Covered Property (1)
Flip-Chip Light Emitting Diodes and Method of Manufacturing Thereof
Patent: 7,872,271 →
Application: 11/632,279 →
Publication: US 2008/0121914
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 19, 2007
From: SEONG, TAE-YEON; SONG, JUNE-O; KIM, KYOUNG-KOOK; HONG, WOONG-KI
To: GWANGJU INSTITUTE OF SCIENCE & TECHNOLOGY
Reel/Frame 020335/0012 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →