Assignment of Assignor's Interest

Recorded: 2010-03-24 Pages: 4

Assignors

UEMATSU, HIROYUKI

Executed: 2010-03-18

KAWABATA, KENICHI

Executed: 2010-03-19

NAGASE, KENJI

Executed: 2010-03-23

Assignee

TDK CORPORATION

1-13-1, NIHONBASHI, CHUO-KU, TOKYO,103-8272, JAPAN

Covered Property (1)

Multilayer Wiring Board and Manufacturing Method Thereof

Patent: 8,591,750 →

Application: 12/659,893 →

Publication: US 2010/0243601

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.