Patent Assignment
Reel/Frame 024167/0196
Assignment of Assignor's Interest
Recorded: 2010-03-31
Pages: 5
Assignors
YUN, PIL SANG
Executed: 2010-03-22
KIM, BYEONG-BEOM
Executed: 2010-03-22
JEONG, CHANGOH
Executed: 2010-03-22
BAE, YANGHO
Executed: 2010-03-22
TOKUCHI, SHIGEKI
Executed: 2010-01-27
TSUKUDA, RYOMA
Executed: 2010-01-27
MATSUURA, YOSHINORI
Executed: 2010-01-27
KUBOTA, TAKASHI
Executed: 2010-01-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN 3-DONG, YEONGTONG-DONG, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Aluminum-Nickel Alloy Wiring Material, Device for a Thin Film Transistor and a Thin Film Transistor Substrate Using the Same, and Method of Manufacturing the Thin Film Transistor Substrate
Application:
12/751,136 →
Publication:
US 2010/0244032
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.