Patent Assignment
Reel/Frame 024173/0280
Assignment of Assignor's Interest
Recorded: 2010-03-29
Pages: 5
Assignee
MICROELECTRICS ASSEMBLY TECHNOLOGIES, INC.
104 T. W. ALEXANDER DRIVE, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Properties
(5)
Thin multi-chip flex module
Application:
12/317,753 →
Publication:
US 2009/0166065
Thin Multi-Chip Flex Module
Thin multi-chip flex module
Application:
12/317,757 →
Publication:
US 2009/0168374
Thin Multi-Chip Flex Module
Thin Multi-Chip Flex Module