Patent Assignment
Reel/Frame 024182/0866
Assignment of Assignor's Interest
Recorded: 2010-04-05
Pages: 4
Assignors
CHIANG, WEN-CHUNG
Executed: 2010-03-14
WU, KENG-CHUNG
Executed: 2010-03-14
HSIEH, YING-CHI
Executed: 2010-03-14
LU, CHENG-KANG
Executed: 2010-03-14
FU, MING-HUANG
Executed: 2010-03-14
Assignee
HIGH CONDUCTION SCIENTIFIC CO., LTD.
NO. 3-1, LANE 108, SEC. 1, NANSHAN RD., LUJHU TOWNSHIP, TAOYUAN, 33861, TAIWAN
Covered Property
(1)
Packaging Device for an Electronic Element and Method for Making the Same