Patent Assignment
Reel/Frame 024210/0714
Assignment of Assignor's Interest
Recorded: 2010-04-09
Pages: 2
Assignors
KAO, CHIH-KUANG
Executed: 2010-03-16
YANG, HUEI-WEN
Executed: 2010-03-07
HUANG, YUNG-SHENG
Executed: 2010-03-17
LIN, YU-WEN
Executed: 2010-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Barrier Layer for Copper Interconnect