IP Library › Assignment 024235/0668
Patent Assignment
Reel/Frame 024235/0668

Assignment of Assignor's Interest

Recorded: 2010-04-07 Pages: 2
Assignor
YU, HONG-CHI
Executed: 2010-03-26
Assignee
WALTON ADVANCED ENGINEERING INC.
18, NORTH FIRST ROAD K.E.P.Z., KAOHSIUNG, R.O.C., TAIWAN
Covered Property (1)
High-Density Integrated Circuit Module Structure
Patent: 8,094,455 →
Application: 12/662,242 →
Publication: US 2011/0211314
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 16, 2016
From: NELSON GLOBAL PRODUCTS, INC., AN INDIANA CORPORATION FORMERLY KNOWN AS MVG ACQUISITION CORP.; WATER WORKS MANUFACTURING, INC., A DELAWARE CORPORATION
To: BMO HARRIS BANK N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 040347/0509 →