Patent Assignment
Reel/Frame 024241/0109
Assignment of Assignor's Interest
Recorded: 2010-04-05
Pages: 3
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Including Removing a Conductive Film Formed Over a Top Surface of an Interlayer Film While Leaving the Conductive Film Formed on a Side Surface and a Bottom Surface of First and Second Trenches
Application:
12/662,189 →
Publication:
US 2010/0258907
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.