Patent Assignment
Reel/Frame 024253/0190
Assignment of Assignor's Interest
Recorded: 2010-04-19
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Structure and Method of Forming a Pad Structure Having Enhanced Reliability