Patent Assignment
Reel/Frame 024314/0441
Assignment of Assignor's Interest
Recorded: 2010-04-22
Received: 2010-04-29
Pages: 4
Assignors
EGITTO, FRANK D.
Executed: 2010-02-28
ANTESBERGER, TIMOTHY
Executed: 2010-03-02
DAS, RABINDRA N.
Executed: 2010-03-04
MARKOVICH, VOYA
Executed: 2010-03-04
WILSON, WILLIAM E.
Executed: 2010-03-04
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NY, 13760, UNITED STATES
Covered Properties
(2)
Method for via Plating in Electronic Packages Containing Fluoropolymer Dielectric Layers
Application:
12/765,110 →
Stabilized Aqueous Aluminum Zirconium Solutions
Application:
12/709,550 →