Patent Assignment
Reel/Frame 024321/0786
Assignment of Assignor's Interest
Recorded: 2010-05-02
Pages: 10
Assignors
LAU, HON SHING
Executed: 2010-04-22
LEE, SHI-WEI
Executed: 2010-03-15
YUEN, MATTHEW MING FAI
Executed: 2010-04-07
WU, JINGSHEN
Executed: 2010-03-29
LO, CHI CHUEN
Executed: 2010-03-15
FAN, HAIBO
Executed: 2010-03-20
CHEN, HAIBIN
Executed: 2010-03-29
Assignee
THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
CLEAR WATER BAY, KOWLOON, HONG KONG, CHINA
Covered Property
(1)
Apparatus Having Thermal-Enhanced and Cost-Effective 3D Ic Integration Structure with Through Silicon via Interposers