Patent Assignment
Reel/Frame 024322/0909
Assignment of Assignor's Interest
Recorded: 2010-05-03
Pages: 3
Assignor
ISOBAYASHI, ATSUNOBU
Executed: 2010-04-30
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
19900 MACARTHUR BOULEVARD, SUITE 400, IRVINE, CALIFORNIA, 92612
Covered Property
(1)
Method for Forming Interconnection Line and Semiconductor Structure
Application:
12/772,294 →
Publication:
US 2011/0266676
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.