IP Library › Assignment 024375/0302
Patent Assignment
Reel/Frame 024375/0302

Assignment of Assignor's Interest

Recorded: 2010-05-12 Pages: 4
Assignors
SU, XILIN
Executed: 2010-03-29
HU, HONGPO
Executed: 2010-03-29
XIE, CHUNLIN
Executed: 2010-03-29
WANG, QIANG
Executed: 2010-03-23
ZHANG, WANG
Executed: 2010-03-29
Assignee
BYD COMPANY LIMITED
NO.3001, HENGPING ROAD,PINGSHAN,LONGGANG DISTRICT, SHENZHEN, 518118, CHINA
Covered Property (1)
Epitaxial Wafer and Manufacturing Method Thereof
Patent: 8,324,634 →
Application: 12/770,130 →
Publication: US 2010/0276812
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2020
From: BYD COMPANY LIMITED
To: BYD MICROELECTRONICS CO., LTD.
Reel/Frame 051561/0906 →
Change of Name Feb 11, 2021
From: BYD MICROELECTRONICS CO., LTD.
To: BYD SEMICONDUCTOR COMPANY LIMITED
Reel/Frame 055280/0971 →