IP Library › Assignment 024398/0054
Patent Assignment
Reel/Frame 024398/0054

Assignment of Assignor's Interest

Recorded: 2010-05-17 Pages: 8
Assignor
JI, HUA XIA
Executed: 2000-11-20
Assignee
EMAGIN CORPORATION
2070 ROUTE 52, BLDG. 334, HOPEWELL JUNCTION, NEW YORK, 12533
Covered Property (1)
Method of Clearing Electrical Contact Pads in Thin Film Sealed Oled Devices
Patent: 7,745,340 →
Application: 11/169,154 →
Publication: US 2006/0051951
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 25, 2006
From: EMAGIN CORPORATION
To: ALEXANDRA GLOBAL MASTER FUND LTD.
Reel/Frame 017982/0743 →
Security Agreement Nov 13, 2007
From: EMAGIN CORPORATION
To: MORIAH CAPITAL, L.P.
Reel/Frame 020098/0610 →
Assignment of Assignor's Interest May 10, 2010
From: GHOSH, AMALKUMAR P.; LIU, YACHIN
To: EMAGIN CORPORATION
Reel/Frame 024361/0491 →
Release of Security Interest Oct 20, 2010
From: MORIAH CAPITAL, L.P.
To: EMAGIN CORPORATION
Reel/Frame 025169/0107 →
Release of Security Interest Jul 25, 2014
From: ALEXANDRA GLOBAL MASTER FUND LTD.
To: EMAGIN CORPORATION
Reel/Frame 033417/0309 →