IP Library › Assignment 024399/0073
Patent Assignment
Reel/Frame 024399/0073

Assignment of Assignor's Interest

Recorded: 2010-05-17 Pages: 3
Assignors
PALMATEER, LAUREN
Executed: 2005-07-12
CUMMINGS, WILLIAM J.
Executed: 2005-06-29
GALLY, BRIAN J.
Executed: 2005-06-27
MILES, MARK W.
Executed: 2005-07-05
SAMPSELL, JEFFREY B.
Executed: 2005-06-28
CHUI, CLARENCE
Executed: 2005-06-28
KOTHARI, MANISH
Executed: 2005-06-29
Assignee
IDC, LLC
2415 THIRD AVE, SAN FRANCISCO, CALIFORNIA, 94107
Covered Property (1)
Method and Device for Packaging a Substrate
Patent: 8,045,835 →
Application: 12/192,908 →
Publication: US 2009/0059342
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 28, 2009
From: IDC, LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 023435/0918 →
Assignment of Assignor's Interest Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →