IP Library › Assignment 024410/0332
Patent Assignment
Reel/Frame 024410/0332

Assignment of Assignor's Interest

Recorded: 2010-05-19 Pages: 2
Assignors
HOMMA, TAKURO
Executed: 2010-02-04
TAKATA, YOSHIFUMI
Executed: 2010-02-04
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Having Surface Protective Films on Bond Pad
Patent: 8,390,134 →
Application: 12/782,784 →
Publication: US 2010/0295044
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →