Patent Assignment
Reel/Frame 024478/0777
Assignment of Assignor's Interest
Recorded: 2010-05-06
Pages: 4
Assignors
WU, CHENG WEN
Executed: 2010-05-03
CHEN, PO YUAN
Executed: 2010-05-03
KWAI, DING MING
Executed: 2010-05-03
CHOU, YUNG FA
Executed: 2010-05-03
Assignee
NATIONAL TSING HUA UNIVERSITY
NO. 101, SEC. 2, KUANG FU ROAD, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Testing Through-Silicon-via and the Circuit Thereof