Patent Assignment
Reel/Frame 024488/0274
Assignment of Assignor's Interest
Recorded: 2010-06-04
Pages: 5
Assignors
GRUENHAGEN, MICHAEL D.
Executed: 2008-11-19
KIM, SUKU
Executed: 2008-11-19
MURPHY, JAMES J.
Executed: 2008-11-19
HO, IHSIU
Executed: 2008-11-19
TJHIA, EDDY
Executed: 2008-11-19
WU, CHUNG-LIN
Executed: 2008-11-19
LARSEN, MARK
Executed: 2008-11-19
DIKSHIT, ROHIT
Executed: 2008-11-19
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
82 RUNNING HILL ROAD, SOUTH PORTLAND, MAINE, 04106
Covered Property
(1)
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of Power Devices, Packages and Systems for Using the Same, and Methods of Making the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.