IP Library Assignment 024505/0019
Patent Assignment
Reel/Frame 024505/0019

Assignment of Assignor's Interest

Recorded: 2010-06-08 Pages: 2
Assignor
FLOYD, PHILIP D.
Executed: 2005-03-15
Assignee
IDC, LLC
2415 THIRD STREET, SAN FRANCISCO, CALIFORNIA, 94107
Covered Property (1)
Method and System for Sealing a Substrate
Patent: 7,642,127 →
Application: 11/779,185 →
Publication: US 2007/0298541
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 28, 2009
From: IDC, LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 023435/0918 →
Assignment of Assignor's Interest Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →