Patent Assignment
Reel/Frame 024518/0354
Assignment of Assignor's Interest
Recorded: 2010-06-10
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2010-04-26
CHEN, KIM HONG
Executed: 2010-04-29
HOU, SHANG-YUN
Executed: 2010-04-26
SHIH, CHAO-WEN
Executed: 2010-04-26
HSIEH, CHENG-CHIEH
Executed: 2010-04-28
YU, CHEN-HUA
Executed: 2010-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Semiconductor Package Interposer with Die Cavity