Patent Assignment
Reel/Frame 024532/0372
Assignment of Assignor's Interest
Recorded: 2010-06-14
Pages: 5
Assignees
STMICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
STMICROELECTRONICS ASIA PACIFIC PTE LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property
(1)
Method of Forming a Die Having an Ic Region Adjacent a Mems Region
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0883 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →