Patent Assignment
Reel/Frame 024540/0071
Assignment of Assignor's Interest
Recorded: 2010-06-15
Pages: 4
Assignors
LIM, BYOUNG MUN
Executed: 2010-03-27
YANG, JANG SIK
Executed: 2010-03-23
LEE, SI HYEOK
Executed: 2010-03-27
CHOI, IN CHUL
Executed: 2010-03-27
Assignees
COMTECH CHEMICAL CO., LTD.
326-2 JINAE-DONG, GIMHAE-SI, GYEONGSANGNAM-DO, 621-220, KOREA, REPUBLIC OF
SUNG SHIN NEW MATERIAL CO., LTD.
11 FLOOR SEONGSIN FRIER BLDG. GEOJE 1-DONG, YEONJE-GU, BUSAN, 611-725, KOREA, REPUBLIC OF
Covered Property
(1)
Injection Molding Apparatus for Shoe or Sole Using Thermoplastic Resin and Thereby Shoes