Patent Assignment
Reel/Frame 024540/0273
Assignment of Assignor's Interest
Recorded: 2010-06-15
Pages: 4
Assignors
THACKER, HIREN D.
Executed: 2010-04-02
SHI, JING
Executed: 2010-04-02
CUNNINGHAM, JOHN E.
Executed: 2010-04-04
KRISHNAMOORTHY, ASHOK V.
Executed: 2010-04-09
Assignee
ORACLE INTERNATIONAL CORPORATION
500 ORACLE INTERNATIONAL CORPORATION, MAIL STOP 5OP7, REDWOOD CITY, CALIFORNIA, 94065
Covered Property
(1)
Assembly of Multi-Chip Modules with Proximity Connectors Using Reflowable Features