Patent Assignment
Reel/Frame 024558/0123
Assignment of Assignor's Interest
Recorded: 2010-06-18
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2010-06-09
HSU, KUO-CHING
Executed: 2010-06-09
CHEN, CHEN-SHIEN
Executed: 2010-06-09
HSIAO, CHING-WEN
Executed: 2010-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Thin Wafer Handling Structure and Method