Assignment of Assignor's Interest

Recorded: 2010-07-01 Pages: 2

Assignor

JOBETTO, HIROYASU

Executed: 2010-06-28

Assignee

CASIO COMPUTER CO., LTD.

6-2, HON-MACHI, 1-CHOME, SHIBUYA-KU,, TOKYO, 151-8543, JAPAN

Covered Property (1)

Semiconductor Device Including Sealing Film for Encapsulating Semiconductor Chip and Projection Electrodes and Manufacturing Method Thereof

Application: 12/828,424 →

Publication: US 2011/0001245

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.