Patent Assignment
Reel/Frame 024667/0283
Assignment of Assignor's Interest
Recorded: 2010-07-12
Pages: 3
Assignor
CHINNUSAMY, SATYA
Executed: 2010-06-22
Assignee
SEMTECH CORPORATION
200 FLYNN ROAD, CAMARILLO, CALIFORNIA, 93012-8790
Covered Property
(1)
Copper Plate Bonding for High Performance Semiconductor Packaging
Application:
12/779,805 →
Publication:
US 2010/0289129
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Grant of Security Interest
Mar 20, 2012
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 027897/0141 →
Release of Security Interest
May 2, 2013
From: JEFFERIES FINANCE LLC
To: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
Reel/Frame 030341/0059 →
Security Agreement
May 2, 2013
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 030341/0099 →