Assignment of Assignor's Interest

Recorded: 2010-07-07 Pages: 2

Assignors

LEE, HYUN-CHUL

Executed: 2010-06-13

LIM, WON-KYU

Executed: 2010-06-13

KIM, JOON-HYUNG

Executed: 2010-06-13

PARK, JAE-SEOK

Executed: 2010-06-13

ROH, CHEOL-LAE

Executed: 2010-06-13

Assignee

SAMSUNG MOBILE DISPLAY CO., LTD.

SAN #24 NONGSEO-DONG, GIHEUNG-GU,, YONGIN CITY, GYUNGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Substrate cutting apparatus and method for cutting substrate using the same

Patent: 9,174,307 →

Application: 12/805,004 →

Publication: US 2011/0049764

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.