Patent Assignment
Reel/Frame 024707/0292
Assignment of Assignor's Interest
Recorded: 2010-07-19
Pages: 5
Assignors
LAW, OSCAR M.K.
Executed: 2009-10-20
WU, KUO H.
Executed: 2009-10-21
YEH, WEI-CHIH
Executed: 2009-10-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Through Silicon via (Tsv) Wire Bond Architecture