Patent Assignment
Reel/Frame 024711/0508
Assignment of Assignor's Interest
Recorded: 2010-07-20
Pages: 4
Assignors
SHIN, SU-DONG
Executed: 2010-04-23
KIM, MYOUNG-JIN
Executed: 2010-04-23
HEO, JEONG-HUN
Executed: 2010-04-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU,, GYEONGGI-DO,, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Horizontal Injection Mold System and Injection Molding Method Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.