Patent Assignment
Reel/Frame 024728/0763
Assignment of Assignor's Interest
Recorded: 2010-07-22
Pages: 3
Assignors
JANG, BOR-PING
Executed: 2010-07-12
HUANG, KUEI-WEI
Executed: 2010-07-13
LIN, WEI-HUNG
Executed: 2010-07-13
LIU, CHUN-SHI
Executed: 2010-07-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Thermal Compress Bonding