IP Library Assignment 024812/0920
Patent Assignment
Reel/Frame 024812/0920

Change of Name

Recorded: 2010-08-11 Received: 2010-08-11 Pages: 6
Assignor
OMG ELECTRONIC CHEMICALS, INC.
Executed: 2010-07-30
Assignee
OMG ELECTRONIC CHEMICALS, LLC
400 CORPORATE COURT, SOUTH PLAINFIELD, NJ, 07080, UNITED STATES
Covered Properties (19)
Barrel Drive Mechanism for Pallets
Application: 12/199,162 →
Motorized Cut and Feed Head
Application: 11/758,727 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application: 11/449,349 →
Method and Composition for Selectively Stripping Nickel from a Substrate
Application: 11/416,729 →
Swiveling and Tilting Roller Axis for Web Guiding in a Fiber Placement Machine
Application: 11/405,784 →
Solution and Process for Improving the Solderability of a Metal Surface
Application: 11/226,613 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application: 11/165,097 →
Fiber Placement Machine
Application: 11/120,722 →
Process for Laying Fiber Tape
Application: 10/936,964 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application: 10/782,177 →
Additives to Stop Copper Attack by Alkaline Etching Agents Such as Ammonia and Monoethanol Amine (Mea)
Application: 10/735,424 →
Printed Wiring Boards and Methods for Making Them
Application: 10/728,423 →
Method for Determining Effective Coefficient of Thermal Expansion
Application: 10/311,574 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application: 10/143,389 →
Methods of Avoiding Blowhole Formation by Conditioning Through Holes and Glass
Application: 10/087,051 →
Method for Roughening Copper Surfaces for Bonding to Substrates
Application: 10/028,955 →
Printed Wiring Boards and Methods for Making Them
Application: 09/954,486 →
Tuned Damped Absorber Support
Application: 09/948,728 →
Method to Improve the Stability of Dispersions of Carbon
Application: 09/915,444 →