Patent Assignment
Reel/Frame 024812/0920
Change of Name
Recorded: 2010-08-11
Received: 2010-08-11
Pages: 6
Assignor
OMG ELECTRONIC CHEMICALS, INC.
Executed: 2010-07-30
Assignee
OMG ELECTRONIC CHEMICALS, LLC
400 CORPORATE COURT, SOUTH PLAINFIELD, NJ, 07080, UNITED STATES
Covered Properties
(19)
Barrel Drive Mechanism for Pallets
Application:
12/199,162 →
Motorized Cut and Feed Head
Application:
11/758,727 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application:
11/449,349 →
Method and Composition for Selectively Stripping Nickel from a Substrate
Application:
11/416,729 →
Swiveling and Tilting Roller Axis for Web Guiding in a Fiber Placement Machine
Application:
11/405,784 →
Solution and Process for Improving the Solderability of a Metal Surface
Application:
11/226,613 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application:
11/165,097 →
Fiber Placement Machine
Application:
11/120,722 →
Process for Laying Fiber Tape
Application:
10/936,964 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application:
10/782,177 →
Additives to Stop Copper Attack by Alkaline Etching Agents Such as Ammonia and Monoethanol Amine (Mea)
Application:
10/735,424 →
Printed Wiring Boards and Methods for Making Them
Application:
10/728,423 →
Method for Determining Effective Coefficient of Thermal Expansion
Application:
10/311,574 →
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Application:
10/143,389 →
Methods of Avoiding Blowhole Formation by Conditioning Through Holes and Glass
Application:
10/087,051 →
Method for Roughening Copper Surfaces for Bonding to Substrates
Application:
10/028,955 →
Printed Wiring Boards and Methods for Making Them
Application:
09/954,486 →
Tuned Damped Absorber Support
Application:
09/948,728 →
Method to Improve the Stability of Dispersions of Carbon
Application:
09/915,444 →