Patent Assignment
Reel/Frame 024858/0331
Assignment of Assignor's Interest
Recorded: 2010-08-19
Received: 2010-08-19
Pages: 2
Assignor
PREISSER, ROBERT F.
Executed: 2010-08-16
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, DEX, 10553, GERMANY
Covered Properties
(3)
Process for Electrodeposition of Copper Chip to Chip, Chip to Wafer and Wafer to Wafer Interconnects in Through-Silicon Vias (Tsv) with Heated Substrate and Cooled Electrolyte
Application:
12/845,801 →
Systems and Methods of Pipelining Multiple Document Node Streams Through a Query Processor
Application:
12/035,592 →
Systems and Methods of Adaptively Screening Matching Chunks Within Documents
Application:
12/035,600 →