Patent Assignment
Reel/Frame 024867/0440
Assignment of Assignor's Interest
Recorded: 2010-08-20
Pages: 5
Assignors
PODDAR, ANINDYA
Executed: 2010-08-16
TU, NGHIA T.
Executed: 2010-08-13
NGUYEN, HAU
Executed: 2010-08-13
Assignee
NATIONAL SEMICONDUCTOR CORPORATION
2900 SEMICONDUCTOR DRIVE, SANTA CLARA, CALIFORNIA, 95051
Covered Property
(1)
A Foil-Based Method for Packaging Intergrated Circuits