Patent Assignment
Reel/Frame 024922/0297
Assignment of Assignor's Interest
Recorded: 2010-09-01
Pages: 3
Assignor
RUDMANN, HARTMUT
Executed: 2010-07-09
Assignee
HEPTAGON OY
TEKNIIKANTIE 12, ESPOO, FI-02150, FINLAND
Covered Property
(1)
Optical Module, Wafer Scale Package, and Method for Manufacturing Those
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2012
From: HEPTAGON OY
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 028574/0208 →
Change of Name
Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
Change of Name
Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →