Patent Assignment
Reel/Frame 024923/0441
Assignment of Assignor's Interest
Recorded: 2010-09-01
Pages: 3
Assignor
YAMASAKI, YASUO
Executed: 2010-08-25
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Property
(1)
Semiconductor Device Having Multi-Layered Wiring Layer and Fabrication Process Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.