Patent Assignment
Reel/Frame 024935/0697
Assignment of Assignor's Interest
Recorded: 2010-09-03
Pages: 4
Assignors
CHANG, HSIN
Executed: 2010-08-30
TSAI, FANG WEN
Executed: 2010-08-30
LIN, JING-CHENG
Executed: 2010-08-30
CHIOU, WEN-CHIH
Executed: 2010-08-30
JENG, SHIN-PUU
Executed: 2010-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Alignment Marks in Substrate Having Through-Substrate Via (TSV)