IP Library Assignment 024969/0184
Patent Assignment
Reel/Frame 024969/0184

Assignment of Assignor's Interest

Recorded: 2010-09-10 Pages: 2
Assignor
OHNUMA, KENTARO
Executed: 2010-08-20
Assignee
YAZAKI CORPORATION
4-28, MITA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Ultrasonic Bonding Method of Electric Wire
Patent: 8,235,276 →
Application: 12/879,341 →
Publication: US 2011/0062218
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →