IP Library Assignment 025037/0473
Patent Assignment
Reel/Frame 025037/0473

Assignment of Assignor's Interest

Recorded: 2010-09-24 Pages: 2
Assignors
CHEN, CHIA-CHUNG
Executed: 2010-09-14
JOU, CHEWN-PU
Executed: 2010-09-14
LIU, SALLY
Executed: 2010-09-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Noise Decoupling Structure with Through-Substrate Vias
Patent: 8,928,127 →
Application: 12/889,650 →
Publication: US 2012/0074515