IP Library Assignment 025069/0153
Patent Assignment
Reel/Frame 025069/0153

Assignment of Assignor's Interest

Recorded: 2010-09-30 Pages: 2
Assignors
RAI, RUTUNJ
Executed: 2010-09-20
HAMPO, RICHARD
Executed: 2010-09-20
MILLS, JOHN
Executed: 2010-09-22
Assignee
LEAR CORPORATION
21557 TELEGRAPH ROAD, SOUTHFIELD, MICHIGAN, 48075
Covered Property (1)
System and Method for Reduced Thermal Resistance Between a Power Electronics Printed Circuit Board and a Base Plate
Patent: 8,848,375 →
Application: 12/886,228 →
Publication: US 2011/0068737
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jun 21, 2011
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026468/0182 →
Security Interest Mar 20, 2013
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 030076/0016 →
Release of Security Interest Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0318 →
Release of Security Interest Feb 5, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037702/0911 →