IP Library Assignment 025214/0871
Patent Assignment
Reel/Frame 025214/0871

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2010-10-28 Received: 2010-10-28 Pages: 5
Assignors
CHOI, DAESIK
Executed: 2010-10-28
KO, WONJUN
Executed: 2010-10-28
YUN, JAEUN
Executed: 2010-10-28
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
SEMICONDUCTOR DEVICE AND METHOD OF STACKING SEMICONDUCTOR DIE IN MOLD LASER PACKAGE INTERCONNECTED BY BUMPS AND CONDUCTIVE VIAS
App. No. 12/914,895