Patent Assignment
Reel/Frame 025214/0894
Assignment of Assignor's Interest
Recorded: 2010-10-28
Received: 2010-10-28
Pages: 5
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TX, 78735, UNITED STATES
Covered Properties
(2)
Method of Producing Layered Wafer Structure Having Anti-Stiction Bumps
Application:
12/914,908 →
Breakout Device with Support Structure
Application:
12/114,425 →