Patent Assignment
Reel/Frame 025306/0561
Assignment of Assignor's Interest
Recorded: 2010-11-12
Pages: 3
Assignors
PARK, SANG-YOUNG
Executed: 2010-10-07
CHA, YOU-MIN
Executed: 2010-10-07
JUNG, WON-WOONG
Executed: 2010-10-07
ROH, YOUN-GOO
Executed: 2010-10-07
MUN, JU-EEL
Executed: 2010-10-07
Assignee
SAMSUNG MOBILE DISPLAY CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC O KOREA
SAN #24 NONGSEO-DONG, GIHEUNG-GU, YONGIN-CITY, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Bonding Apparatus and Substrate Bonding Method
Application:
12/900,451 →
Publication:
US 2011/0083788
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.