Patent Assignment
Reel/Frame 025319/0329
Assignment of Assignor's Interest
Recorded: 2010-11-05
Pages: 3
Assignor
ARAI, TADASHI
Executed: 2010-11-04
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Board, Manufacturing Method of the Wiring Board, and Semiconductor Package