Patent Assignment
Reel/Frame 025343/0311
Assignment of Assignor's Interest
Recorded: 2010-11-10
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Component Having a Second Passivation Layer Having a First Opening Exposing a Bond Pad and a Plurality of Second Openings Exposing a Top Surface of an Underlying First Passivation Layer