Patent Assignment
Reel/Frame 025379/0223
Change of Name
Recorded: 2010-11-16
Pages: 4
Assignor
NORTHFIELD ACQUISITION CO.
Executed: 2004-10-19
Assignee
MULTEK FLEXIBLE CIRCUITS, INC.
1150 SHELDAHL ROAD, NORTHFIELD, MINNESOTA, 55057-9444
Covered Properties
(21)
Method of Making Metal-Film Laminate Resistant to Delamination
Patent:
5,112,462 →
Application:
07/580,505 →
Metal-Film Laminate Resistant to Delamination
Patent:
5,137,791 →
Application:
07/681,073 →
Surface Mounted Components on Flex Circuits
Patent:
5,133,118 →
Application:
07/740,931 →
Metal-Film Laminate Resistant to Delamination
Patent:
5,364,707 →
Application:
07/909,058 →
Direct Application of Unpackaged Integrated Circuit to Flexible Printed Circuit
Patent:
5,261,593 →
Application:
07/932,064 →
Direct Application of Unpackaged Integrated Circuit to Flexible Printed Circuit
Patent:
5,349,500 →
Application:
08/081,544 →
Flexible Multilayer Printed Circuit Boards and Methods of Manufacture
Patent:
5,527,998 →
Application:
08/142,243 →
Printed Wiring Board with Photoimageable Dielectric Base Substrate and Method of Manufacture Therefor
Patent:
5,709,979 →
Application:
08/327,236 →
Metal-Film Laminate Resistant to Delamination
Patent:
5,480,730 →
Application:
08/339,029 →
Multilayer Electronic Circuit Having a Conductive Adhesive
Patent:
5,688,584 →
Application:
08/534,630 →
Flexible Multilayer Printed Circuit Boards and Methods of Manufacture
Patent:
5,800,650 →
Application:
08/543,623 →
Method for Interconnecting a Flip Chip to a Printed Circuit Substrate
Patent:
5,615,477 →
Application:
08/644,585 →
Heat Sink Structure Comprising a Microarray of Thermal Metal Heat Channels or Vias in a Polymeric or Film Layer
Patent:
5,930,117 →
Application:
08/646,522 →
Method of Manufacturing a Multilayer Electronic Circuit
Patent:
5,727,310 →
Application:
08/661,809 →
Adherent Film with Low Thermal Impedance and High Electrical Impedance Used in an Electronic Assembly with a Heat Sink
Patent:
5,798,171 →
Application:
08/675,564 →
Printed Circuit Assembly with Fine Pitch Flexible Printed Circuit Overlay Mounted to Printed Circuit Board
Patent:
5,719,749 →
Application:
08/685,425 →
Adherent Film with Low Thermal Impedance and High Electrical Impedance Used in an Electronic Assembly with a Heat Sink
Patent:
5,766,740 →
Application:
08/743,661 →
Metal-Film Laminate Resistant to Delamination
Patent:
6,060,175 →
Application:
08/891,113 →
Charge Transfer Load Sensor
Patent:
6,104,100 →
Application:
09/014,026 →
Printed Circuit Board Assembly Using a Unique Cooperative Bonding and Connecting System
Patent:
6,226,862 →
Application:
09/070,505 →
Printed Circuit Board Assembly Having Adhesive Joint
Patent:
6,384,339 →
Application:
09/804,132 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 4, 2014
From: SWISHER, RICHARD L.
To: SHELDAHL, INC.
Reel/Frame 032140/0053 →
Assignment of Assignor's Interest
Dec 16, 2014
From: CASSON, KEITH L.; MYERS, CAROL; GILLEO, KENNETH B.; SUILMANN, DEANNA M.
To: SHELDAHL, INC.
Reel/Frame 034521/0088 →
Assignment of Assignor's Interest
Dec 16, 2014
From: NEUMAN, DAVID
To: SHELDAHL, INC.
Reel/Frame 034521/0211 →
Assignment of Assignor's Interest
Jul 11, 2017
From: MULTEK FLEXIBLE CIRCUITS, INC.
To: MULTEK TECHNOLOGIES LIMITED
Reel/Frame 042979/0368 →
Assignment of Assignor's Interest
Jan 11, 2018
From: MULTEK TECHNOLOGIES LIMITED
To: FLEX LTD
Reel/Frame 044596/0965 →