IP Library Assignment 025379/0560
Patent Assignment
Reel/Frame 025379/0560

Assignment of Assignor's Interest

Recorded: 2010-11-16 Pages: 2
Assignor
LOO, KUM WENG
Executed: 2010-09-01
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Semiconductor Package with Thermal Heat Spreader
Patent: 8,338,943 →
Application: 12/873,068 →
Publication: US 2012/0050996
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →