Patent Assignment
Reel/Frame 025436/0387
Assignment of Assignor's Interest
Recorded: 2010-12-02
Pages: 2
Assignee
LINTEC CORPORATION
23-23 HONCHO, ITABASHI-KU, TOKYO, 173-0001, JAPAN
Covered Property
(1)
Adhesive Sheet for a Stealth Dicing and a Production Method of a Semiconductor Wafer Device