IP Library Assignment 025507/0818
Patent Assignment
Reel/Frame 025507/0818

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2010-12-15 Received: 2010-12-15 Pages: 3
Assignor
PENDSE, RAJENDRA D.
Executed: 2010-12-14
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
Semiconductor Device and Method of Forming Flipchip Interconnection Structure with Bump on Partial Pad
App. No. 12/969,451